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Nowadays, Wi-Fi devices are ubiquitous in our lives. Casually open the home wireless routing management interface, there may be no less than 10 Wi-Fi devices online at the same time. The increase in the number of devices leads to network congestion, performance degradation, increased delay and other problems. These problems became more serious in the era of Wi-Fi 5 (802.11 ac). Therefore, when designing Wi-Fi 6 (802.11 ax), experts made improvements and innovations specifically for the problem of network congestion. So, what new technologies does Wi-Fi 6 use to improve wireless channel capacity? When the user equipment receives the AP signal, it will compare whether the color it receives is consistent with the current associated AP color. When the color is the same, the user will think that the signal is the signal in the cell. If the color of the received signal is different from that of the associated AP, the user determines that the signal belongs to the interference signal. As shown in the following figure, due to the use of different color codes, the channel 1 of the green cell is no longer interfered by the adjacent cell channel 1 (blue and red).

Due to the spread of the global COVID-19 epidemic in 2020, automobile production is in the doldrums (figure 1). The number of cars produced worldwide, which was 92.18 million in 2019 before the COVID-19 epidemic, fell by 14.56 million to 77.62 million in 2020 and appears to have fallen by 1.2 million to 76.42 million in 2021. The decline in car production in 0A2020 was caused by the COVID-19 epidemic, which led to a sharp drop in demand. However, the downturn in car production in 2021 is mainly due to a shortage of semiconductors. In fact, by 2021, the shortage of semiconductors has made it impossible to build cars, and the governments of Japan, the United States and Germany, with automobile as the core industry, have made requests to TSMC to increase the production of on-board semiconductors through the government of Taiwan. The semiconductors in short supply at that time were 28nm logic semiconductors and MCU (Micro Controller Units, commonly known as “microcontrollers”).

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

Easybom, an international integrated service provider for the electronics industry, persists in pursuing the concept of “win-win”. Dedicated to providing electronic component big data information services that are maintained by senior industry engineers, easybom has established an excellent communication platform for merchandisers, suppliers, and engineers through our powerful electronic component search engine. Easybom will keep focusing on the leverage of our high-quality services for data mining and information matching. Easybom establishes a communication bridge for suppliers, purchasers and engineers with electronic component data as its core. Find additional details at https://www.easybom.com/.