Best electronic components information sheets? In the onboard system shown in the figure above, the green rectangle represents the printed circuit board (PCB), and the small rectangles of various colors above represent various functional modules in the system, such as memory. The functions of these modules are implemented by independent silicon chips, and they are connected by metal traces on the PCB to finally form a complete system. The System-on-Chip refers to the realization of the functions of the entire system on a single silicon chip. The schematic diagram is as follows: As shown in the figure above, a system-on-a-chip (SoC) implements various functional modules such as storage, processing, logic, and interfaces in one chip, rather than requiring several different physical chips to be implemented like a system-on-board. Compared with system-on-board, SoC solutions are lower cost, enable faster and more secure data transfer between different system units, have higher overall system speed, lower power consumption, smaller physical size, and better reliability. Read even more information at qsb30024s28.

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Orthogonal frequency division multiple access OFDMA: Friends who are familiar with Wi-Fi should know that the empty port of Wi-Fi adopts orthogonal frequency division multiplexing (OFDM) modulation, that is, the whole bandwidth is composed of orthogonal subcarriers. In Wi-Fi 6, the 802.11 working group introduced OFDMA access from LTE. The addition of such an “A” word can be said to have brought a qualitative change to the network capacity. As shown in the figure on the left below, Wi-Fi 5-based OFDM can only allocate all the bandwidth in the channel to one user at any one time, even if that user’s data needs do not need to take up all the bandwidth. When other users connect to the network, they need to wait for the next sending opportunity window (TXOP). This is very inefficient in the use of channel resources, especially when there is a significant increase in equipment.

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors. See extra info on electronic componets.